Nanolaminated thin film circuitry materials
US6212078A · kind A · utility
79Cited by
11References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 1999 |
| Grant date | Apr 3, 2001 |
| Priority date | — |
| Expiry date | Oct 27, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Nanolaminates are formed by alternating deposition, e.g., by combustion chemical vapor deposition (CCVD), layers of resistive material and layers of dielectric material. Outer resistive material layers are patterned to form discrete patches of resistive material. Electrical pathways between opposed patches of resistive material on opposite sides of the laminate act as capacitors. Electrical pathways horizontally through resistive material layers, which may be connected by via plated holes, act as resistors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.