Optical module
US6212212A · kind A · utility
5Cited by
4References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 2, 1998 |
| Grant date | Apr 3, 2001 |
| Priority date | — |
| Expiry date | Sep 2, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrode of a laser diode (LD) is joined with a Si substrate via a solder layer. A cavity region is formed directly under the LD in the solder layer. The solder layer spreads outside the cavity region. Since there arises no stress in a space of the cavity region, the internal stress of the active layer, which is formed directly over the cavity region, is relaxed as compared with that in a conventional optical module, which is provided with no cavity region in the solder layer. Accordingly, a highly reliable optical module can be obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.