Low stress method and apparatus of underfilling flip-chip electronic devices
US6213347A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 30, 1999 |
| Grant date | Apr 10, 2001 |
| Priority date | — |
| Expiry date | Apr 30, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for the fabrication of a semiconductor assembly and a method of underfilling flip-chip devices are disclosed. The apparatus for multiple controlled dispensing of polymeric precursors filled with silica and anhydrides comprises a center feed tube supplying the proecursor; a header connecting the center tube to a plurality of distribution tubes, whereby the distribution tubes acquire predetermined distances from the center tube; a nozzle at the end of each distribution tube; and these nozzles having increasingly larger cross sections, the farther the respective distribution tube is positioned from the center tube, whereby the dispense rate of the precursor remains the same for all distribution tubes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.