Bonding a diamond compact to a cemented carbide substrate
US6213380A · kind A · utility
13Cited by
9References
13Claims
0Family size
Inventors
Key dates
| Filing date | Jan 25, 1999 |
| Grant date | Apr 10, 2001 |
| Priority date | — |
| Expiry date | Jan 25, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2237/52
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of bonding a diamond compact comprising a polycrystalline mass of diamond and a bonding phase which contains free-silicon to a substrate is provided. The method includes the steps of contacting a surface of the compact with carbon or nitrogen or a mixture thereof under conditions suitable to cause free-silicon in the surface to react with the carbon and/or nitrogen and thereafter bonding that surface to the substrate, preferably by means of a braze. In a preferred form of the invention, the surface which is bonded to the substrate is acid cleaned after contact of that surface with carbon or nitrogen or a mixture thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.