IC socket
US6213806A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 22, 1999 |
| Grant date | Apr 10, 2001 |
| Priority date | — |
| Expiry date | Feb 22, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1069
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In an IC socket, a pressure cover is disposed to be rotatable so as to be opened or closed with respect to a socket body, so that when the pressure cover is closed, an IC package mounted on the socket body is pressed. The pressure cover is provided with a heat sink and a heat of the IC package is radiated therefrom through a press-contact of the heat sink to the IC package. The pressure cover is formed with a heat sink receiver on an inner surface side to the socket body so as to receive the heat sink and a holding member is disposed on an inner surface side of the pressure cover to be detachable so as to detachably hold the heat sink between the heat sink receiver and the holding member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.