Adhesive compositions and methods of use
US6214460A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 1998 |
| Grant date | Apr 10, 2001 |
| Priority date | — |
| Expiry date | Nov 16, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2891
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A screen-printable adhesive composition capable of being applied to a substrate at room temperature comprising at least one alkyl acrylate; at least one reinforcing comonomer, a polyepoxide resin, and a polyepoxide resin curing agent; wherein said composition is substantially solvent free and said composition has a yield point of greater than 3 Pascals and a viscosity of less than 6000 centipoise. In another aspect, the invention provides heat-curable electrically and/or thermally conductive adhesive films that are substantially solvent-free acrylic polymers further containing a polyepoxide resin, a polyepoxide resin curing agent, and an electrically conductive material and/or a thermally conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.