Photosensitive resin compositions
US6214516A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2000 |
| Grant date | Apr 10, 2001 |
| Priority date | — |
| Expiry date | Mar 24, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0046
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A positive photosensitive resin composition comprising (a) a silane diol such as diarylsilane diol or dialkylsilane diol, (b) one or more polybenzoxazole precursors having the structure: ##STR1## wherein Ar.sub.1 is a tetravalent aromatic group, aliphatic group, heterocyclic group, or mixtures thereof; Ar.sub.2 is a divalent aromatic, heterocyclic, alicyclic, or aliphatic group that optionally may contain silicon; Ar.sub.3 is divalent aromatic group, aliphatic group, heterocyclic group, or mixtures thereof; (c) a photosensitive agent, and (d) a solvent. The composition optionally includes an adhesion promoter, leveling agent, or mixtures thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.