Sensor device and method of forming a sensor device
US6214634A · kind A · utility
15Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2000 |
| Grant date | Apr 10, 2001 |
| Priority date | — |
| Expiry date | Feb 7, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor device (20) comprises a sensor package (22) having a cavity (24) formed therein, a sensor die (26) mounted on a bottom surface (28) of the cavity (24) and a protective coating (30) formed over the sensor die in the cavity. The protective coating (30) is formed from a material, preferably a polymer material, which is arranged to have a graduated cross-linking density such that the material at the top of the cavity (24) has a high density of cross-linking and the material at the bottom of the cavity (24), which material is in contact with the sensor die, has a low density of cross-linking.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.