Epoxy mold compound and method
US6214905A · kind A · utility
1Cited by
2References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 24, 1998 |
| Grant date | Apr 10, 2001 |
| Priority date | — |
| Expiry date | Nov 24, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Mold compounds for encapsulating semiconductors are disclosed. The compounds achieve high levels of adhesion to uncleaned printed wiring board substrates by minimizing the level of silicone fluid in the compound. Methods for encapsulating semiconductor dies and processes for encapsulating the dies also are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.