Patent · US Expired

Intermediate softening point resin-based hot melt PSAs

US6214935A · kind A · utility

18Cited by
20References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 15, 1998
Grant dateApr 10, 2001
Priority date
Expiry dateJul 15, 2018

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L2666/24
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

An improved hot-melt pressure-sensitive adhesive (HMPSA) composition contains an elastomeric component, such as a blend of SIS and SB block copolymers, and a tackifying component comprising one or more intermediate softening point resins (ISPRs) having a ring and ball softening point of from 35 to 60.degree. C. The improved adhesive compositions are characterized by reduced volatility, less bleed and staining tendencies, and improved overall adhesive performance. The invention also provides improved label constructions in which a release liner is coated with an HMPSA composition and laminated to a flexible facestock. Notably, even when low basis weight paper facestocks are used, the construction can be converted at high speeds.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.