Process for determining the instantaneous penetration depth and a machining laser beam into a workpiece, and device for implementing this process
US6215094A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 1996 |
| Grant date | Apr 10, 2001 |
| Priority date | — |
| Expiry date | May 28, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The penetration depth of a machining laser beam into workpiece is continuously monitored in that a measuring laser beam is directed onto the vapor capillary that is generated in the workpiece by the machining laser beam. The portion of the measuring laser beam that re-emerges from the vapor capillary is monitored by a sensor whose output signal is then used to bring about (producing holes) or to adjust (welding or superficial re-melting of a workpiece) the desired penetration depth defined by a pre-selected reference signal
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.