Circuit board with interleaved TO-220 heat sinks
US6215662A · kind A · utility
7Cited by
14References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2000 |
| Grant date | Apr 10, 2001 |
| Priority date | — |
| Expiry date | Mar 13, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides a printed circuit board that has electronic power switches. The switches include vertical heat conductive metal backings, for attaching heat sinks. Each heat sink includes a main panel and two flanking fin panels. The main panels are attached to the metal backings and are arranged vertically, such as according to the TO-220 methodology. The invention provides bringing the power switches close to each other, and interleaving the fins according to various configurations, pairs or chain. Openings in the fin panels become aligned with each other, permitting a stream of air to move through them.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.