Instrument panel top cover with integral foamed components
US6217098A · kind A · utility
18Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1998 |
| Grant date | Apr 17, 2001 |
| Priority date | — |
| Expiry date | Nov 12, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB60Y2306/09
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
An instrument panel top cover is provided with an integrally molded foam underside. The integrally molded foam underside provides a number of components that have been supplied separately in the prior art. The use of the integrally molded foam underside thus eliminates the need for many separate components and improves upon the instrument panel top covers of the prior art.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.