Solderless pin connection
US6217346A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 11, 1999 |
| Grant date | Apr 17, 2001 |
| Priority date | — |
| Expiry date | May 11, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/931
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solderless pin connection for a printed circuit board wherein a substrate is printed with polymer thick film. The substrate includes an inner surface defining a hole. The polymer thick film is applied along a top surface of the substrate and along the inner surface. The polymer thick film may additionally be applied along a bottom surface of the substrate with an additional layer along the inner surface. A pin, having a diameter less than a diameter of the hole, is press fit within the polymer thick film along the inner surface the pin. The pin is staked with respect to the substrate using a mechanical connection such as barbs or a folded portion on a staked end of the pin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.