Grinding machine spindle flexibly attached to platform
US6217420A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 1998 |
| Grant date | Apr 17, 2001 |
| Priority date | — |
| Expiry date | Dec 15, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A grinding or polishing machine comprises a rigid platform on which a workhead spindle and a grinding wheel spindle are located. The grinding wheel spindle is mounted on a sub-assembly which is attached to the platform by means of flexures which permit limited movement of the sub-assembly in a direction generally parallel to the direction in which the wheel has to advance to achieve grinding or polishing of a workpiece mounted on the workhead spindle. The flexures generally inhibit movement of the sub-assembly in all other directions. Two grinding wheels are mounted on the platform, one on each of two sub-assemblies, and each sub-assembly is attached to the platform by flexures as aforesaid. The flexure mounting points are located generally centrally of the machine and are located on either side of and close to the machine centre line. In a grinding or polishing machine having workpiece spindle means, tool spindle means mounted on sub-assemblies which permit limited relative movement in one direction to effect tool and workpiece engagement cam drive means is provided whereby each sub-assembly is movable to advance or retract each tool spindle towards and away from the workhead spin…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.