Mobius strip belt for linear CMP tools
US6217427A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 6, 1999 |
| Grant date | Apr 17, 2001 |
| Priority date | — |
| Expiry date | Apr 6, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A tool for the linear polishing of substrates includes an endless belt of continuous strength wrapped substantially as a helix of predetermined length and width with a 180 degree twist along the length to increase by a factor of 2.times. the time interval between which belt changes need to be made because of wear-and-tear, significantly reducing the costs associated with the polishing because of reduced down time. In a preferred embodiment for the chemical-mechanical polishing of silicon wafer substrates used in fabricating integrated circuits, the endless belt is constructed as a Mobius strip of a rubberized, urethane composition to be flexible, but yet strong enough to withstand the applied pressure between the polishing belt and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.