Polishing pads and methods relating thereto
US6217434A · kind A · utility
29Cited by
9References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 1999 |
| Grant date | Apr 17, 2001 |
| Priority date | — |
| Expiry date | Dec 17, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D13/142
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.