Method for inserting an electronic module in a card body with electronic memory
US6217685A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 1999 |
| Grant date | Apr 17, 2001 |
| Priority date | — |
| Expiry date | Mar 22, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The invention concerns a method for inserting an electronic module (13) on a thermoplastic substrate (131) in a cavity (12) provided in a card with electronic memory in thermoplastic material. The invention is characterized in that it consists in the following steps: a) depositing in said cavity (12) an adhesive (14) for gluing the electronic module (13) thermoplastic substrate (131) on the card body (11) thermoplastic material; b) arranging the electronic module (13) in the cavity (12); c) simultaneously applying a pressing force (F) on the electronic module (13) and ultrasonic energy (US) on the cavity (12) thermoplastic material, in contact with the electronic module (13) thermoplastic substrate (131). The invention is useful for making cards with electronic memory.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.