Process for producing Ti-Cr-Al-O thin film resistors
US6217722A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2000 |
| Grant date | Apr 17, 2001 |
| Priority date | — |
| Expiry date | Jan 3, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C7/006
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Thin films of Ti-Cr-Al-O are used as a resistor material. The films are rf sputter deposited from ceramic targets using a reactive working gas mixture of Ar and O.sub.2. Resistivity values from 10.sup.4 to 10.sup.10 Ohm-cm have been measured for Ti-Cr-Al-O film <1 .mu.m thick. The film resistivity can be discretely selected through control of the target composition and the deposition parameters. The application of Ti-Cr-Al-O as a thin film resistor has been found to be thermodynamically stable, unlike other metal-oxide films. The Ti-Cr-Al-O film can be used as a vertical or lateral resistor, for example, as a layer beneath a field emission cathode in a flat panel display; or used to control surface emissivity, for example, as a coating on an insulating material such as vertical wall supports in flat panel displays.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.