Solder resist composition and printed circuit boards
US6217987A · kind A · utility
96Cited by
25References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 1997 |
| Grant date | Apr 17, 2001 |
| Priority date | — |
| Expiry date | Sep 16, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solder resist composition comprises an acrylate of novolac type epoxy resin and an imidazole curing agent and has a viscosity of 0.5-10 Pa.multidot.s adjusted with glycol ether type solvent. A printed circuit board is formed by using such a solder resist composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.