Laminated structure, covering structure and pouch
US6218017A · kind A · utility
31Cited by
1References
53Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1997 |
| Grant date | Apr 17, 2001 |
| Priority date | — |
| Expiry date | Sep 30, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A laminated structure (1) has a heat sealant layer (2), an antistatic layer (3) of a bisammonium organic sulfur semiconductor formed on one surface of the heat sealant layer (2). An oriented resin layer (14) is formed on the other surface of the heat sealant layer (2). The laminated structure (1) is adhered to a container with a side thereof on the side of the antistatic layer (3) to the container.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.