Resin etching solution and process for etching polyimide resins
US6218022A · kind A · utility
8Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 1997 |
| Grant date | Apr 17, 2001 |
| Priority date | — |
| Expiry date | Sep 9, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A resin etching solution containing a hydroxyalkylamine, an alkali metal compound and water, or an aliphatic alcohol, an aliphatic amine, an alkali metal compound and water, and a process for etching a polyimide film containing a resist pattern or metal layer pattern formed on either or both sides using the resin etching solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.