Pattern-forming methods
US6218083A · kind A · utility
18Cited by
75References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 1999 |
| Grant date | Apr 17, 2001 |
| Priority date | — |
| Expiry date | Mar 5, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0082
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for producing a predetermined resist pattern on e.g. a lithographic printing plate, circuit board or mask comprises the imagewise exposure of a radiation sensitive diazide-containing coating (conventionally considered as a UV sensitive material), to non-UV radiation, such as direct heat radiation or infra-red radiation. A positive of the exposed image is revealed on development. Additionally, it has been found that a flood exposure to UV radiation after the imagewise exposure to the non-UV radiation means that a negative of the exposed image is revealed, on development.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.