Epoxy resin, process for preparing the resin and photo-curable resin composition and resin composition for powder coatings containing the epoxy resin
US6218482A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 1998 |
| Grant date | Apr 17, 2001 |
| Priority date | — |
| Expiry date | Jan 9, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D163/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin containing group(s) of formula (1) and having a number average molecular weight of 400-10,000, an epoxy equivalent of 100-5,000 and an average number of glycidyl ether groups per molecule of 2-50 ##STR1## wherein A is a group ##STR2## (wherein R.sup.3 is a saturated aliphatic polyhydric alcohol residue having 2 to 30 carbon atoms, D is oxyalkylene group, a, b, c and d are 0-25, e and f are 0-4, e+f equals 0-4 and a+b+c.times.e+d.times.f equals 0-50), and B is ##STR3## (g, h are 0-18), etc. and R.sup.1 and R.sup.2 are H, glycidyl or a group of the formula ##STR4## wherein A and B are as defined above, and R.sup.7, R.sup.8 and R.sup.9 are H or glycidyl group; its preparation, and photo-curable and powder coating resin compositions containing the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.