Foil circuit boards and semifinished products and method for the manufacture thereof
US6218628A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 1996 |
| Grant date | Apr 17, 2001 |
| Priority date | — |
| Expiry date | Jan 18, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for the manufacture of printed circuit boards, foil circuit boards and semifinished products for printed and foil circuit boards formed from preliminary products with electrically conductive coatings (7, 8) structurable to conductor patterns and structurable substrates (4), for the formation of connectors (V), contours (K) and conductor patterns (L), the connectors (V), contours (K) and conductor patterns (L) being structured simultaneously or in the same method steps from the preliminary products, and the connectors (V) and contours (K) are part of the structured preliminary product substrate, the connectors (V) being brought for electrical or mechanical connection into a position in which they are connectable and the finished conductor patterns (L) can be separated at contours (K).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.