Atmospheric pressure inductive plasma apparatus
US6218640A · kind A · utility
13Cited by
7References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 19, 1999 |
| Grant date | Apr 17, 2001 |
| Priority date | — |
| Expiry date | Jul 19, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K10/003
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An inductive plasma torch operating at atmospheric pressure is used for wafer or glass substrate processing. Said torch employs a linear type of plasma confinement. This linear torch is particularly suitable for photoresist etching and processes in which it has the advantages of high chemical isotropic etch rate and low plasma damage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.