Polycrystalline diamond cutters having modified residual stresses
US6220375A · kind A · utility
138Cited by
20References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 13, 1999 |
| Grant date | Apr 24, 2001 |
| Priority date | — |
| Expiry date | Jan 13, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2998/10
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The residual stresses that are experienced in polycrystalline diamond cutters, which lead to cutter failure, can be effectively modified by selectively thinning the carbide substrate subsequent to high temperature, high pressure (sinter) processing, by selectively varying the material constituents of the cutter substrate, by subjecting the PDC cutter to an annealing process during sintering, by subjecting the formed PDC cutter to a post-process stress relief anneal, or a combination of those means.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.