Method for soldering microstructured sheet metal

US6220497A · kind A · utility

Assignee

• XCELLSiS GmbH · DE

Inventors

• Uwe Benz · Giengen an der Brenz, DE
• Lothar Haug · Eßlingen, DE
• Wolfgang Kleinekathoefer · Schwäbisch Gmünd, DE
• Peter Waitkat · Bad Liebenzell, DE

Key dates

• Filing date: Jan 19, 1999
• Grant date: Apr 24, 2001
• Expiry date: Jan 19, 2019

Classification

• Technology area (CPC F): Mechanical Engineering; Lighting; Heating
• CPC primary: F28F2260/02
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

In method for soldering metal microstructured plates, stacks of plates and solder layers are prepared by placing the solder layers between each adjacent plate. The thickness of the solder layers range from 3 to 25 .mu.m. The stack is then soldered by heating it in a vacuum or an inert atmosphere.