Manifolds for use in water heat distribution systems
US6220520A · kind A · utility
9Cited by
6References
35Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 23, 1999 |
| Grant date | Apr 24, 2001 |
| Priority date | — |
| Expiry date | Dec 23, 2019 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF24D3/1066
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A modular manifold includes master modules and possibly also slave modules which each provide a respective terminal unit with a relatively constant rate of water flow at a modulated supply water temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.