Patent · US Expired

Hermetically sealed package and method of assembly

US6220766A · kind A · utility

16Cited by
8References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 25, 1998
Grant dateApr 24, 2001
Priority date
Expiry dateAug 25, 2018

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG02B6/4248
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A hermetically sealed structure, particularly for use in an optoelectronic device is described. The structure comprises an outer sleeve of a material resistant to moisture ingress with an insert located in the sleeve at one end portion thereof and having a bore therethrough. An optical fibre extends through the bore and beyond the end portion of the sleeve with adhesive films respectively securing the insert to the sleeve and the optical fibre to the insert. A method of assembly for such a package is also described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.