Method for forming metal conductor patterns on electrically insulating substrates and supports
US6221229A · kind A · utility
4Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 1999 |
| Grant date | Apr 24, 2001 |
| Priority date | — |
| Expiry date | Sep 9, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/175
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In order to form metallic conductor patterns having connection regions that can be soldered and/or bonded on electrically insulating substrates, firstly a metalization is applied to the substrate and is then removed again, at least in those regions adjoining the desired conductor pattern. There then follows the electrolytic deposition of a final surface which can be soldered and/or bonded to the connection regions. Clean-room conditions are not necessary.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.