Plating method and apparatus
US6221230A · kind A · utility
Inventors
Key dates
| Filing date | May 14, 1998 |
| Grant date | Apr 24, 2001 |
| Priority date | — |
| Expiry date | May 14, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/026
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for forming a layer of plating on a base material and a method for manufacturing a three dimensional object. The plating apparatus includes a nozzle for delivering a stream of plating fluid and an electric source for applying a voltage between the base material and the nozzle. The nozzle has an outer wall and a stem located at its center. The nozzle delivers plating fluid from the opening of the nozzle in an annular manner to produce a stream that has a substantially uniform flow velocity when the stream hits the base material. In an another embodiment, the nozzle has surrounding conduit for conducting air. The air increases the velocity of a peripheral portion of the stream. To manufacture a three dimensional object, a plating layer is deposited, and the nozzle is moved to form a desired shape while piling the layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.