Process for plating metal coating

US6221440A · kind A · utility

Assignee

• Atotech Deutschland GmbH & Co. KG · DE

Inventors

• Heinrich Meyer · Berlin, DE
• Ralf Schulz · Speyer, DE

Key dates

• Filing date: Apr 2, 1997
• Grant date: Apr 24, 2001
• Expiry date: Apr 2, 2017

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/388
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A process for depositing metal coatings on polyimide surfaces for producing conductor tracks includes depositing a first metal coating by decomposition of volatile metal compounds by a glow discharge in a gas mixture containing inert gases and oxygen containing compounds, followed by electroless deposition of a second metal coating from an acid or neutral metallizing bath.