Epoxy resin composition for encapsulating photosemiconductor element and photosemiconductor device
US6221510A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 1999 |
| Grant date | Apr 24, 2001 |
| Priority date | — |
| Expiry date | Apr 21, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12528
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition for encapsulating a photosemi-conductor element excellent in releasing property from a mold in forming and in adhesion to the photosemi conductor element is provided. The epoxy resin composition comprises element comprising the following components (A) to (D): PA1 (A) an epoxy resin; PA1 (B) a hardener; PA1 (C) a silane coupling agent having an epoxy group, a mercapto group or an amino group; and PA1 (D) a releasing agent in which a molecule thereof has structure moieties represented by the following general formulas (1) and (2) and in which the weight ratio of the structure moiety represented by general formula (2) is 25% to 95% by weight based on the whole molecule, EQU .paren open-st.CH.sub.2 CH.sub.2.paren close-st..sub.m (1) PA1 wherein m is a positive integer of 8 to 100 and EQU .paren open-st.CH.sub.2 CH.sub.2 O.paren close-st..sub.n (2) PA1 wherein n is a positive integer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.