High-current circuit trace and composition and method therefor
US6221514A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 1999 |
| Grant date | Apr 24, 2001 |
| Priority date | — |
| Expiry date | Aug 30, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12715
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method by which a conventional circuit trace (14) is modified with a layer (16) of high-conductivity solder alloy to yield a high-current circuit trace (12) for high-current routing on a substrate (10). The method generally entails the use of a solder composition that contains a dispersion of metal particles (18) in a solder alloy (20). The metal particles (18) are selected on the basis of having a higher electrical conductivity than the solder alloy (20), and are present in sufficient amounts so that the electrical conductivity of the solder composition is significantly higher than that of the solder alloy (20). The solder composition is deposited on a conductor (14), and then reflowed to form a conductive layer (16) on the conductor (14). The metal particles (18) remain as a discrete dispersion within the conductive layer (16) in order to suitably promote the conductivity of the layer (16). The solder composition is preferably deposited in an amount sufficient to increase the current-carrying capacity of the resulting circuit trace (12) for high-current routing on the substrate (10), e.g., in excess of six amps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.