Reduction of mechanical stress in shallow trench isolation process
US6221733A · kind A · utility
10Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 13, 1998 |
| Grant date | Apr 24, 2001 |
| Priority date | — |
| Expiry date | Nov 13, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/05
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of minimizing mechanical stress generated during the trench-forming/trench-filling process steps in a standard shallow trench isolation (STI) process is provided. This is achieved by forming trenches with a more sloped and smoother profile, and/or limiting the trench depth to be less than 0.4 .mu.m, and/or reducing or increasing the trench densification temperature, and/or performing the densification step after the chemical-mechanical polishing step. In addition, a furnace TEOS oxide film is used as the trench-filling material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.