Film carrier and semiconductor device using same
US6222272A · kind A · utility
17Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 1998 |
| Grant date | Apr 24, 2001 |
| Priority date | — |
| Expiry date | Oct 16, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a film carrier with a conductive circuit formed, an opening is formed in a particular position relative to where the conductive path is to be formed. The opening is a through-hole, filled with a conductive material to form a conductive path. The conductive circuit has a concave face, provided according to certain formulae. The film carrier can cope with a fine-pitched and highly dense mounting, while prohibiting pulling out of the conductive path by an external force. The film carrier does not suffer from fallout of the conductive path, and has increased electrical connection reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.