Patent · US Expired

Packaging platform, optical module using the platform, and methods for producing the platform and the module

US6222967A · kind A · utility

60Cited by
6References
23Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 13, 1998
Grant dateApr 24, 2001
Priority date
Expiry dateMar 13, 2018

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG02B6/4292
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A packaging platform for optically coupling one or more optical waveguides of one or more optical components having the optical waveguide to one or more optical fibers is provided with a reference structure portion for the horizontal and vertical positioning of the optical component. The platform is further provided with one or more fiber positioning portions for inserting and holding the optical fiber and positioning the optical fiber at a position where the optical fiber is optically connected to the optical waveguide. The provided packaging platform and an optical module using the platform can simplify all alignment steps for optical coupling, electrical connection and sealing in the coupling of the optical component and the optical fiber.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.