Breadmaker circuit board mounting method
US6223430A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 1999 |
| Grant date | May 1, 2001 |
| Priority date | — |
| Expiry date | Apr 30, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An automatic breadmaker with improved thermal sensing, wiring, and a simplified assembly procedure. The breadmaker preferably includes a high voltage circuit board coupled to an interior wall of the breadmaker, the interior wall separating the baking chamber of the breadmaker from a component compartment. One or more thermal control devices electrically connected to the high voltage circuit board are disposed in a heat transfer relationship with the interior wall, thereby improving device accuracy and avoiding the need for leads to the thermal control devices. In the most preferred embodiment of the present invention, the high voltage circuit board is coupled to the interior wall via a component mounting bracket which also holds the thermal control devices against the interior wall. Preferably, the breadmaker also has a low voltage circuit board connected to the high voltage circuit board via low voltage leads, thereby providing additional safety for users operating a control panel near the low voltage circuit board. In this case, the high voltage circuit board is a power board supplying power to the various breadmaker components, such as the motor, heater, and fan, and the low vol…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.