Method and apparatus for the temperature regulation of components, for example semiconductor circuits, printed circuit boards and the like
US6223975A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 1999 |
| Grant date | May 1, 2001 |
| Priority date | — |
| Expiry date | Oct 22, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for the temperature regulation of components such as semiconductor circuits, printed circuit boards and the like. The components are conveyed on carriers through an inlet slot into a temperature regulating housing provided with temperature regulating members and are convey out through an outlet slot opposite the inlet slot. In the housing, the carriers are loaded on a magazine provided with adjacently arranged holders. After the first holder is loaded in the starting position, the magazine is displaced progressively in one direction into successive positions in which the remaining holders of the magazine are loaded one after the other. Once all the holders are loaded, the magazine is filled and in an end position. Thereupon the magazine is displaced back to its starting position in a fast reverse run in the opposite direction. Back in the starting position, a new carrier is conveyed in through the inlet slot thereby causing the temperature regulated carrier occupying the holder to be conveyed out through the outlet slot. Successive loading of the holders in the magazine causes off-loading of the temperature regulated carriers. By this process a temperature re…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.