High speed jet soldering system
US6224180A · kind A · utility
Inventors
Key dates
| Filing date | Feb 21, 1997 |
| Grant date | May 1, 2001 |
| Priority date | — |
| Expiry date | Feb 21, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3485
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Continuous jetting of liquid metal droplets for deposit on a substrate includes an ejector, a deflection device, a print chute, and a collection reservoir. Liquid metal from a cartridge in the ejector provides a continuous molten material stream through an orifice-defining structure while a vibration device creates a standing wave in the stream to break the molten material stream into individual droplets which receive charge from a charging device. The deflection device enables the positioning of the charged droplets to be controlled for placement on a substrate. Control systems assist in the calibration and control of the continuous stream to ensure that selected droplets are placed at desired locations on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.