Methods and apparatus for chemical mechanical planarization using a microreplicated surface
US6224465A · kind A · utility
10Cited by
4References
19Claims
0Family size
Inventor
Key dates
| Filing date | Jun 26, 1997 |
| Grant date | May 1, 2001 |
| Priority date | — |
| Expiry date | Jun 26, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/888
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical planarization process employs a microreplicated surface comprising a regular array of precisely shaped three-dimensional structures such as pyramids, cones, or cube-corners. In a preferred embodiment, asperities of the microreplicated surface employed in an advancing linear belt are allowed to ablate during processing, effectively resulting in a two-phase grinding/polishing operation that increases the material removal rate and increases workplace throughput.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.