Patent · US Expired

Combined cutting and grinding tool

US6224469A · kind A · utility

29Cited by
13References
4Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 5, 1999
Grant dateMay 1, 2001
Priority date
Expiry dateFeb 5, 2019

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB24D7/06
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A tool is constructed by a plurality of diamond columns 22 arranged so as to protrude from a working surface and a conductive bond member 24 for integrally fixing the diamond columns. The conductive bond member is electrolytically dressed while a conductive liquid is supplied between the bond member and an electrode 4 which faces the bond member at a distance, thereby enabling the diamond columns 22 to protrude. By this construction, the tool can be applied to both an efficient rough cutting for a ductile material and a precise grinding for a brittle material without detaching or re-attaching a workpiece, the relatively soft ductile material such as aluminum, copper, or plastic can be worked with a deep cut, the brittle material such as monocrystal silicon, glass, or tungsten carbide can be efficiently and stably ground, so that a fluctuation of a working position due to wear can be compensated.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.