Method of forming bump electrodes
US6225205A · kind A · utility
34Cited by
6References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 21, 1999 |
| Grant date | May 1, 2001 |
| Priority date | — |
| Expiry date | Jan 21, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0113
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a plurality of bump electrodes en bloc on a bump electrode formation surface of a wafer from which chips are to be separated, or on an upper surface of a plurality of chips which are separated from a wafer and placed side by side, the upper surface constituting a bump electrode formation surface, is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.