Thermosetting resin composition
US6225418A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 1999 |
| Grant date | May 1, 2001 |
| Priority date | — |
| Expiry date | Mar 25, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermosetting resin composition obtained by heat treating, under the specified conditions, a mixture of a polyaddition thermosetting resin, a silicic compound (oligomer) having a functional group capable of causing an addition reaction with a curing agent for the polyaddition thermosetting resin, and water, followed by adding of a curing agent for the polyaddition thermosetting resin is useful for producing thermosetting resin molded articles, resin encapsulated semiconductor devices, automobile parts, etc., which are high in heat resistance, small in change of elastic modulus at high temperatures, and resistant to crack and peeling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.