Hot-melt pressure sensitive adhesive for adhesive strips
US6225520A · kind A · utility
7Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 9, 1998 |
| Grant date | May 1, 2001 |
| Priority date | — |
| Expiry date | Jun 9, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to a pressure-sensitive hot-melt adhesive composition characterized in that it includes PA1 a) at least one ethylene-vinyl acetate, ethylene-methyl acrylate or ethylene-butyl acrylate copolymer PA1 b) a solid tackifying resin PA1 c) a liquid tackifying resin PA1 d) an antioxidant PA1 e) and optionally a diluent. The invention also relates to the use of the pressure-sensitive hot-melt adhesive composition for the preparation of labels and adhesive tapes and more particularly of the tapes intended to come into contact with the skin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.