Heatsink with high thermal conductivity dielectric
US6225571A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 19, 1999 |
| Grant date | May 1, 2001 |
| Priority date | — |
| Expiry date | Feb 19, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a heatsink for use with a heat-generating electrical component. The heatsink comprises a spine having opposing sides, cooling fins extending from the spine, and a dielectric layer adhered to at least one of the opposing sides. The dielectric layer has a thermal conductivity of at least about 1 W/m.degree. C. The heatsink may further comprise a metal layer adhered to the dielectric layer. The metal layer provides a surface to which an electric component can be adhered. The heatsink can further include a heat-generating component adhered to the metal layer. In another aspect, the heat-generating component is a surface-mount electrical component adhered to the metal layer with solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.