Ball grid array to prevent shorting between a power supply and ground terminal
US6225702A · kind A · utility
33Cited by
14References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 4, 1998 |
| Grant date | May 1, 2001 |
| Priority date | — |
| Expiry date | Feb 4, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3436
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device manufactured as a ball grid array, chip scale package, or other surface mounting package wherein shorting between a power supply terminal and a ground terminal can be prevented. At least one solder ball functioning as a signal electrode is disposed between a solder ball functioning as a power supply electrode and a solder ball functioning as a ground electrode on the mounting surface of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.