Friction hinge having high thermal conductivity
US6226177A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 1999 |
| Grant date | May 1, 2001 |
| Priority date | — |
| Expiry date | Jun 8, 2019 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE05Y2999/00
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
The invention is a friction hinge assembly for a laptop computer which has a high thermal conductivity. The assembly includes a base element, a base element fixed to the base of the computer and to which an axially aligned base heat pipe is coupled. The assembly also includes a lid element fixed to the lid of the computer. The lid element has a body portion and a rotatable sleeve attached to the lid and which receives a lid heat pipe. The base and lid elements are pre-assembled selectively fastenable to one another for ease of assembly of the lid to the base, and in order to control the frictional torque produced by the hinge during operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.