Arrangement including a substrate for power components and a heat sink, and a method for manufacturing the arrangement

US6226183A · kind A · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Bernd Weber · Töging am Inn, DE
• Dietmar Hofsaess · Backnang, DE
• Werner Butschkau · Bietigheim-Bissingen, DE
• Thomas Dittrich · Süderbrarup, DE
• Peter Schiefer

Key dates

• Filing date: Jun 21, 1999
• Grant date: May 1, 2001
• Expiry date: Jun 21, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/2036
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

In an arrangement composed of a substrate and a heat sink, the substrate is provided on a first side with at least one power component arranged on a first large-surface printed circuit trace and, on a second side opposite the power component, with a second large-surface printed circuit trace, which is connected in a thermally conductive manner to the first printed circuit trace via via holes. The substrate is mounted at the second side onto the heat sink in a thermally conductive manner, in order to achieve a good heat coupling of the substrate to the heat sink and the same time to avoid an undesirable electrical contact between the potential-carrying printed circuit traces and the heat sink. The substrate having spacer elements arranged on the second side is placed onto the heat sink and to hold it at a defined distance from the heat sink, the gap formed by the distance between the substrate and the heat sink being filled with a thermally conductive filler.